Technical Support
Comprehensive technical resources, application support, and expert guidance for Vicor power solutions. Access selection guides, application notes, thermal design resources, and packaging technology information.
Expert Technical Support for Vicor Solutions
As an authorized Vicor distributor, we provide comprehensive technical support to ensure successful implementation of Vicor power solutions. Our team of Field Application Engineers (FAEs) have deep expertise in power electronics, with specialized knowledge of Vicor technologies, including Factorized Power Architecture (FPA), ChiP packaging, and advanced power conversion techniques.
Our support resources include detailed application notes, selection guides, thermal design recommendations, and packaging technology explanations to assist with design-in and optimization of Vicor products.
Support Resources
Selection Guides
Comprehensive guides to help you choose the right Vicor solution for your specific application requirements.
Technical implementation guides with practical examples and design recommendations for Vicor products.
Application Notes
Thermal Design
Guidelines and best practices for thermal management of Vicor power modules in your application.
Packaging Technology
Information on Vicor's advanced packaging solutions including ChiP, VIA, and other technologies.
Frequently Asked Questions
Answers to common questions about Vicor products and implementation best practices.
Contact FAE
Direct access to our Field Application Engineering team for specialized support.
Featured Technical Resources
Understanding FPA: Factorized Power Architecture
Learn how Factorized Power Architecture separates voltage regulation from current multiplication to achieve superior efficiency and power density in high-performance computing applications.
Read Article Download PDFThermal Design for Vicor Current Multipliers
Comprehensive thermal management guidelines for Vicor BCM and VTM modules, including heat sink selection, airflow requirements, and thermal modeling.
Read Guide Download PDF48V to Load Power Delivery: Architecture Comparison
Compare different power delivery architectures for 48V to load applications, including efficiency, density, and implementation considerations.
Read Guide Download PDFChiP Packaging: High-Density Power Solutions
Explore how ChiP (Converter housed in Package) technology enables ultra-high power density while maintaining excellent thermal performance.
Read Article Download PDFNeed Specialized Technical Support?
Our FAE team is ready to help with your specific power design challenges. Contact us for application-specific guidance, design reviews, or custom solution development.